Shitaya Bld.6f,2-5, Higashiueno,5-chome, Taito-ku, Tokyo, 110-8510 Japan
|TEIKAWELD method uses a thermit reaction in ordr to obtain a molecular
level adhesion, which fact is quite different from any kinds of mechanical
crimping. A molecular level adhesion gives an excellent electric conductivity
at the weld portion as well as robustness against corrosion or looseness.
A long-term performance consistency can be achieved by the method. The
method does not require any electric power or heat. The method can be operated
anywhere only with the powder and the mold. The method should not be restricted
only to connect copper to copper or to connect copper to iron. The method
has a wide capability to connect various kinds of metals with different
shapes by selecting the appropriate mold. The TEIKAWELD powder contains
some special ingredients in copper oxide and aluminum mixture. Safe and
rapid operation can be obtained by these ingredients.